Dynex’s press-pack IGBT are made with numbers of innovative technologies:

• Dynamic load-balancing (DLB) technology maximizes safe operating area, gives high reliability, and improves ease of use compared to conventional press-pack IGBT designs.
• Silver-sinter bonding applied to basic units between the chip and adjacent molybdenum platelets ensures outstanding reliability and improved thermal performance.
• Silicone edge passivation applied to Dynex’s press-pack chips and a hermetically sealed housing give robust high voltage blocking performance.

A dedicated auxiliary emitter connection ensures synchronization of gate drive signals between chips, mitigating the effects of power circuit di/dt on the driver circuit.